Product Yield Enhancement Development Failure Analysis Engineer (High Bandwidth Memory)
Our vision is to transform how the world uses information to enrich life for _all_.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Micron in Boise, Idaho has a current need for a Level 2 or 3 HBM (High Bandwidth Memory ) Product Yield Enhancement PDFA Engineer position open where you will work on the Product Development Failure Analysis team to take next generation HBM devices from design to mass production!
As part of the HBM Product Development Failure Analysis (PDFA) team, you will play a meaningful role in bringing next-generation HBM products from design through qualification and into high production manufacturing. The team focuses on ensuring product reliability, accelerating time-to-market, and enabling rapid production ramp by identifying and resolving component-level failures during new product introduction phases.
In this role, you will apply electrical, physical, and statistical failure analysis techniques to characterize failures, identify root causes, and drive corrective actions. You will collaborate with multi-functional engineering teams and leverage advanced analytics, statistical methods, and AI-enabled tools to improve failure detection, yield, reliability, and overall product performance.
Responsibilities
- Perform electrical, physical, and statistical failure analysis to identify, characterize, and understand defect and failure mechanisms in HBM products.
- Analyze component- and system-level data to resolve root causes of failures using statistical techniques, engineering methodologies, and AI-enabled tools.
- Apply AI tools (e.g., Copilot, Claude) and improved analytics to enhance failure detection, reliability learning cycles, yield improvement, and component performance.
- Work closely with Product, Process, Test, Quality, and Manufacturing Engineering teams to resolve fabric...
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